The phoenix nanotom® s is the first 180 kV / 15 W nanofocus computed tomography (nano ct) system perfectly tailored to applications e.g. in material science, precision injection moulding, micromechanics, electronics geology and biology. With its 180 kV / 15 W ultra high performance nanofocus X-ray tube, precision mechanics and advanced software modules, the nanotom® is the inspection solution for a wide range of 3D CT applications. Once scanned, the fully three dimensional CT information allows many possibilities for analysis, e.g. non-destructive visualization of slices, arbitrary sectional views, or automatic pore analysis. Since the whole geometry of the object is scanned, precise 3D measurements of complex objects or even the automatic generation of first article inspection reports within an hour are possible.
- First 180 kV / 15 W nanoCT® system with low maintenance, long-life open X-ray tube
- High precision rotation-unit with air bearing for accurate and reliable CT images
- Granite-based manipulation and optional thermal stabilization for long-term stability and highest precision
- Up to 2 times faster data acquisition at the same high image quality level by diamond|window (optionally)
- 4 operation modes from submicron to high-intensity applications
- Automated generation of first article inspection reports in < 1 hour possible
- Excellent software modules for highest CT quality and ease of use, e.g.
- High precision and reproducible 3D metrology by click & measure|CT with datos|x 2.0: fully automated execution of CT scan,reconstruction and analysis process
- Accelerated 3D CT reconstruction results within a few seconds or minutes (depending of the volume size) by velo|CT
- Very compact system even for small labs
The classic application of industrial X-ray 3D computed tomography (micro ct and nano ct) is the inspection and three-dimensional measurement of metal and plastic castings. However, phoenix|x-ray’s high-resolution X-ray technology opens up a variety of new applications in fields such as sensor technology, electronics, materials science, and many other natural sciences.
The 3D X-ray image shows the interior coil behind the end cap. In any conventional radiograph, the layers would be overlapping, but the nanoCT® succeeds in displaying the object layer by layer.
3D metrology with X-ray is the only technique allowing to non-destructively measure the interior of complex objects. By contrast with conventional tactile coordinate measurement technique, a computed tomography scan of an object acquires all surface points simultaneously – including all hidden features like undercuts which are not accessible non-destructively using other methods of measurement. The v|tome|x s has a special 3D metrology package that contains everything needed for dimensional measuring with the greatest possible precision, reproducibility and user-friendliness, from calibration instruments to surface extraction modules. In addition to 2D wall thickness measurements, the CT volume data can be quickly and easily compared with CAD data, for example, in order to analyze the complete component to ensure it complies with all specified dimensions.
High-resolution computed tomography (micro ct and nano ct) is used for inspecting materials, composites, sintered materials and ceramics but also to analyze geological or biological samples. Materials distribution, voids and cracks are visualized three-dimensionally at microscopic resolution.
In plastics engineering, high-resolution X-ray technology is used to optimize the casting and spraying process by detecting contraction cavities, blisters, weld lines and cracks, and to analyze flaws. X-ray computed tomography (micro ct and nano ct) provides three-dimensional images of object characteristics such as grain-flow patterns and filler distribution as well as of low-contrast defects.
In the inspection of sensors and electronic components, high-resolution X-ray technologies are mostly used to inspect and evaluate contacts, joints, cases, insulators and the situation of assembly. It is even possible to inspect semiconductor components and electronic devices (solder joints) without having to disassemble the device.
High-resolution computed tomography (micro ct and nano ct) is widely used in inspecting geological samples, for example in the exploration for new resources. High-resolution CT-systems provide three-dimensional images at microscopic resolution of rock samples, binders, cements and cavities and help identify certain sample characteristics such as size and location of voids in oil-bearing rock.